News

Tokyo, Japan at Tokyo Big Sight: The 46th Nepcon Japan on January 18-20th, 2017 You will find Inkron at two locations at Nepcon. Inkron co’exhibits with Nagase at stand W2-34 (IC-Packaging) and W20-14 (Wearables). Learn about Inkron’s latest material solutions for semiconductor, LED, display and optical device packaging and light optimization. We shall exhibit our siloxane based thermally conductive and solvent free Die Attach paste product-series, High and Low Refractive

Shanghai, China and SNIEC (Shanghai New International Expo Center): International LED Illumination Exhibition on December 1-3, 2016 Meet Inkron at this year’s premier LED show in Shanghai and learn about Inkron’s latest material solutions for LED, display and optical device packaging and light optimization. We  exhibit our thermally conductive Die attach paste product-series, High and Low Refractive Index Encapsulants and coatings as well as our printable conductive and dielectric inks

Santa Clara, CA, USA through November 16 to 17th, 2016 Inkron co-exhibits with Nagase at Printed Electronics USA. In this show Inkron shall introduce its range of optical coating materials designed for wearable and other optical applications. Additionally Inkron’s portfolio of functional printable inks for electronic sensors are presented. Products presented include among other UV curable printable conductors, solvent free UV curable dielectrics and optical coatings with very low and

Munich Germany, Messe Munchen through November 8 to 11, 2016 – electronica 2016 Meet Inkron at Hall C4, Booth 300 and learn the latest of Inkron’s solutions for emerging displays and optical devices, electronics packaging and printable sensors. We exhibit our low temperature, UV-curable, conductive and dielectric inks, High and Low RI materials for optics, OLED and flexible displays and more. Information of Inkron’s packaging service for SSL, optical sensors

Grenoble France, Alpexpo through October 25 to 27, 2016 – Semicon and Flex Europe 2016. Meet Inkron at stand No 541 and learn the latest of Inkron’s solutions for electronics packaging, coatings and inks for optical devices and printable sensors. We exhibit our low temperature, UV-curable, conductive and dielectric inks, optical materials for OLED and flexible displays as well as our encapsulation solutions with high Refractive Index. The optical packaging

Bregenz, Austria through September 20 to 22, 2016 – LpS 2016, LED Symposium + EXPO. Meet Inkron at booth D at LpS 2016 to learn Inkron’s latest material solutions for LED, display and optical device packaging and light optimization. We shall exhibit our thermally conductive Die attach paste product-series, High and Low Refractive Index Encapsulants and coatings as well as our printable conductive and dielectric inks and pastes. These products

NAGASE Group as NAGASE & CO., LTD. and Nagase ChemteX Corporation today announced a move to expand its relationship with Inkron Limited, by the acquisition of a minority stake in Inkron Limited. At the same time, the Companies agree on extensive global collaboration in commercialization and distribution of Inkron’s technology and products. This move is expected to accelerate Inkron’s technology and product penetration into the global electronic and semiconductor markets

Taipei, Nangang Exhibition Center through September 7 to 9, 2016 – Semicon Taiwan 2016. Meet Inkron at Sigmatek booth 2509 at Semicon China to learn Inkron’s latest material solutions for Advanced Electronics Integration. We explain our low temperature, UV-curable and ink-jetting metal and dielectric inks, optical materials for OLED and flexible displays and encapsulation solutions with highest Refractive Index in the market for Optical Wafer Scale Packaging. See you there

Taipei, Nangang Exhibition Hall 4F through August 24 to 26, 2016 – Touch Taiwan 2016. Meet Inkron at Sigmatek booth M1014 and learn about Inkron’s photopatternable dielectrics for current and emerging displays and touch sensors. Additionally highly transparent coatings with high and low Refractive Indices for OLED, flexible displays, touch sensors and optical devices are presented. Inkron will also present its printable and highly transparent dielectrics as well as Inkron

INS. Hong Kong, SAR China and HELSINKI, Finland 26.4.2016 – Inkron, a technology leader in printed nano-composite siloxane based electronic packaging materials for the optoelectronics; printed electronics and display industries, announces today the availability of turnkey optoelectronic service solutions to address megatrends in industrial internet applications utilizing its advanced inks and pastes. The Optoelectronic industry including LEDs, lasers and optical sensors’ market size in 2015 was over $35 billion and

Inkron Explains Its New Services, Products and Capabilities at“Printed Electronics Europe 2016” Estrel Conference Hotel, Berlin on 27-28 April, 2016 – Booth F13. Inkron, the leading siloxane based electronics pastes and inks producer, explains its technology offering at the major printed electronics show in Europe – Printed Electronics – Europe 2016. The event takes place in Berlin on 27-29th of April, including talks from academic and business leaders accompanied by a

Estrel Conference Hotel  Berlin on 27-28 April 2016 Printed Electronics Europe 2016 Trade show is here again !  Inkron will exhibit its latest products and technological innovations related with printed electronics such as inkjettable dielectrics, UV curable conductors and more. Meet us at our booth F13 and learn more about our latest printable offering for the Internet of Things, Lighting and smart devices.

Shanghai New International Expo Center, March 15-17, 2016 – Semicon China 2016. Meet Inkron at Nagase booth N5-538 at Semicon China to learn Inkron’s material solutions for Advanced Electronics Integration. We explain our low temperature, UV-curable and ink-jetting metal and dielectric inks, optical materials for OLED and flexible displays and encapsulation solutions with highest Refractive Index in the market for Optical Wafer Scale Packaging. See you there !

TOKYO, Japan and HELSINKI, Finland (2nd of February 2016) – Nagase & Co., Ltd. and Nagase ChemteX Corporation (herein after jointly called Nagase), a major global group providing marketing, sales and manufacturing of specialty and electronics materials for semiconductor, display and other electronics applications; and Inkron, a technology leader in printed siloxane based nano-ink and paste materials for the display, semiconductor and printed electronics industries, today announced the start of

Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016. Meet Inkron at Nagase booths E52-40 (Hall 6) and E21-13 (Hall 3) at Nepcon to learn Inkron’s material solutions for Wearable and Advanced Electronics Integration. We explain our low temperature, UV-curable and ink-jetting metal and dielectric inks, optical materials for OLED and flexible displays and encapsulation solutions with highest Refractive Index in the market for Optical Wafer Scale Packaging. See

Taipei, Nangang Exhibition Hall through August 26 to 28, 2015 – Touch Taiwan 2015. Meet Inkron at Howteh booth K916 and learn about Inkron’s Low and High temperature OC solutions as well as highly transparent high and low RI coating solutions for touch sensors and optical devices. Inkron will also present its printable and highly transparent dielectric solutions.

Nangang – The 11th Led Lighting exposition – LED Lighting, Taiwan 2015, connected with Photonics Festival 2015 show takes place June 16-18, 2015. Meet Inkron in Nangang TWTC Exhibition Hall at Sigmatek booth N416 and learn about Inkron’s solutions for LED’s – thermally conductive siloxane based die attach product range and high RI encapsulation solutions as well as printable conductors and dielectrics for Internet of things and smart devices.

New ILE-500 encapsulant product line with industry’s highest refractive index increases light output efficacy of LED packages up to 10%   HELSINKI, Finland, May 5, 2015 – Inkron Oy, a leading manufacturer of advanced materials for the lighting, smart device, semiconductor and printed electronics industries, today announced its latest product introduction – the ILE-500 encapsulant product line. In an industry dominated by a few large silicone material providers, new product

  BERLIN – Printed Electronics Europe 2015 Trade show is here again April 28-29, 2015 – Inkron will exhibit its latest products and technological innovations related with printed electronics. Meet us at our booth B05 and learn about our latest printable offering for the Internet of Things, Lighting and  smart devices.  

A 3rd Party study reports Inkron’s IDA-125 nanosilver Die Attach material superior thermal performance in high power density UV COB LEDs. According to the study IDA-125 Die Attach material results in less than 0.2 K/W total thermal impedance between chip die and interconnection substrate. As there is a rapidly growing industrial market for high-power ultraviolet (UV) requiring high-output sources novel packaging solutions are needed in order to ensure maximum efficiency

MUNICH – LOPEC 2015 – 3/3/2015 Inkron Oy revealed its latest product offering providing a critical solution for the fabrication of low cost electronics for the Internet of Things including wearables and sensors. A study of high volume roll-to-roll printing of organic electronics revealed an Inkron product as the preferred material of choice. In a publication in the January 2015 issue of Organic Electronics, authors by VTT and BASF highlighted

LAS VEGAS – Strategies in Light – 2/25/2015  Inkron Oy, a leading manufacturer of advanced materials for the lighting, LED, display, optical, semiconductor and printed electronics industries introduces two flagship product series for next generation LED applications in solid state lighting, display and mobile devices: the Inkron Die Attach (IDA) and Inkron LED Encapsulation (ILE) product series. Based on novel nanomaterials and siloxane polymer chemistries, Inkron’s core technology platform enables new

  Inkron shall exhibit at the IMAPS 2014 , October 14-15th, 2014 in San Diego California. Please come and visit us at our stand to discuss how Inkron’s product line and technology might be of help to you. We will present our latest thermally and electrically conductive paste and ink products as well as their applications in electronics industry. Inkron’s series of light management materials and dielectrics will be also

1.9.2014 Inkron shall exhibit at the  Printed electronics show PE2014 , October 7-9th, 2014 in Grenoble France.  Inkron’s stand is 958. Please come and visit us at our stand to discuss how Inkron’s product line and technology might be of help to you. We will present our latest thermally and electrically conductive paste and ink products as well as their applications in electronics industry. Inkron’s series of light management materials

  Inkron shall exhibit at the SEMICON Taiwan 2014 , September 3-5th, 2014 in Taipei Taiwan. Please come and visit us at the stand of Grand Trend Corp to discuss how Inkron’s product line and technology might be of help to you. We will present our latest thermally and electrically conductive paste and ink products as well as their applications in electronics industry. Inkron’s series of light management materials and

Inkron exhibits at the LOPEC 2014 Tradeshow, May 27-28th, 2014 in Munich Germany.  Inkron’s stand is located in Hall B0, stand 519A. Please come and visit us at our stand to discuss how Inkron’s product line and technology might be of help to you. We will present our thermally and electrically conductive paste and ink products as well as their applications in electronics industry.

 Inkron’s high electrically and thermally conductive die attach adhesive (25W/mK) IDA-122 is now being introduced world-wide to customers in the LED and Semiconductor industries. This new design in die attach material is based on Inkron’s IP in novel siloxane matrix chemistry and silver coupling technology and will enable innovations at the both a customer’s manufacturing process and product design levels. The IDA-122 has very high thermal stability after low temperature