Inkron Exhibits its latest solutions for LED and optical device packaging at LpS 2016

Bregenz, Austria through September 20 to 22, 2016 – LpS 2016, LED Symposium + EXPO.

Meet Inkron at booth D at LpS 2016 to learn Inkron’s latest material solutions for LED, display and optical device packaging and light optimization. We shall exhibit our thermally conductive Die attach paste product-series, High and Low Refractive Index Encapsulants and coatings as well as our printable conductive and dielectric inks and pastes. These products may be used also on Wafer Level and Flip chip packaging designs. Further information is also available on Inkron’s packaging services allowing LED and optical device production.