LAS VEGAS – Strategies in Light – 2/25/2015
Inkron Oy, a leading manufacturer of advanced materials for the lighting, LED, display, optical, semiconductor and printed electronics industries introduces two flagship product series for next generation LED applications in solid state lighting, display and mobile devices: the Inkron Die Attach (IDA) and Inkron LED Encapsulation (ILE) product series. Based on novel nanomaterials and siloxane polymer chemistries, Inkron’s core technology platform enables new categories of LEDs with increased efficiency and reliability at lower cost.
As the trend in LED applications continues to focus on improving device efficiency and lifetime while lowering cost, key challenges facing next generation LEDs include the utilization of novel phosphors (narrow bandwidth phosphors like quantum dots), optimization of LED packaging to increase reliability and enablement of advanced packaging concepts such as wafer level and chip-scale packaging.
Please visit us in Las Vegas at Strategies in Light 2015 conference at booth #436.
IDA – Die Attach Series. The IDA series includes pastes for the attachment of LED chips to common packaging substrates. All products in this family distinguish themselves through high thermal conductivity and stability meeting the requirements of high power devices and applications. IDA products are available as electrically conductive or insulating versions and can be transparent or reflective addressing a wide range of package designs. In collaboration with world leading customers and development partners, the IDA product series has been shown to reduce the thermal contact resistance in device packages thereby lowering the junction temperature, yielding a brightness increase by 3-5%, and increasing the device lifetime and reliability compared to LED packages using conventional die attach materials.
ILE – LED Encapsulation Series. Inkron LED encapsulation products distinguish themselves by offering a wide range of refractive indices (from 1.25 to 1.93) while maintaining very high transparency enhancing the brightness and efficiency of LED packages. In addition, these products offer superior barrier properties (e.g. more than 2.5x) against environmental influences (e.g. air, water, sulfur) compared to conventional commercial LED encapsulation products. ILE products are available in thermally as well as UV curable form. The latter option offers the opportunity to increase fab throughput and yield.
