Inkron at Nepcon Japan! Inkron shall exhibit its latest material solutions for IC and Optical Packaging as well as the inks for Wearables, Printed Electronics and IoT Technology.

Tokyo, Japan at Tokyo Big Sight: The 46th Nepcon Japan on January 18-20th, 2017

You will find Inkron at two locations at Nepcon. Inkron co’exhibits with Nagase at stand W2-34 (IC-Packaging) and W20-14 (Wearables).

Learn about Inkron’s latest material solutions for semiconductor, LED, display and optical device packaging and light optimization. We shall exhibit our siloxane based thermally conductive and solvent free Die Attach paste product-series, High and Low Refractive Index Encapsulants and coatings. The products for Wafer Level and Flip chip packaging designs are also available.

Range of flexible screen and inkjet printable inks are presented on Wearables-booth (W20-14). You will hear about UV curable conductive silver ink, solvent free and pinhole free dielectric and conductive and semi conductive inks for wearable, printed electronics and sensor applications.