provides LED- and Opto-packaging services and LED design. The designs cover for
example white light disinfection, multi-wavelength and special purpose
LED-components, modules and Chip-on-Board components.
Inkron’s flexible assembly line supports
custom and special LED-packaging in small to medium volumes. Line capabilities
include die pick up, die attach, flip-chip, wire bonding, encapsulation, glop
top/lensing, burn-in, stress runs, testing and packing.