LED Design and Prototyping

Inkron provides LED- and Opto-packaging services and LED design. The designs cover for example white light disinfection, multi-wavelength and special purpose LED-components, modules and Chip-on-Board components. 

Inkron’s flexible assembly line supports custom and special LED-packaging in small to medium volumes. Line capabilities include die pick up, die attach, flip-chip, wire bonding, encapsulation, glop top/lensing, burn-in, stress runs, testing and packing.

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