Inkron’s high electrically and thermally conductive die attach adhesive (25W/mK) IDA-122 is now being introduced world-wide to customers in the LED and Semiconductor industries. This new design in die attach material is based on Inkron’s IP in novel siloxane matrix chemistry and silver coupling technology and will enable innovations at the both a customer’s manufacturing process and product design levels.
The IDA-122 has very high thermal stability after low temperature cure (150C/30min) and is a solvent free, single component system. The adhesive has very long work time at RT (>2 weeks) and shelf life (6 months, +4C) and is compatible with all current production lines. By virtue of being solvent free, voiding and cracking – two common reliability failures – are easily avoided thereby rendering improved overall board level reliability.
