Inkron introduces a New Structural Adhesive and Underfill product line at Printed Electronics Europe 2019

Printed electronics comprises of many enabling materials, equipment and components, from mature technologies such as

LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most

Find out about the newest arrivals in Inkrons product portfolio and meet us at the

To hear the latest news on our newest materials don’t forget to visit the Inkron/Nagase/Nagase

We’re attending the Printed Electronics 2018 event! Meet us at booth C10 to find out