Inkron’s platform technologies:
Meet us at the EPIC Meeting on Wafer Level Optics hosted by SUSS MicroOptics on November, 7-8th. Inkron will present its latest nanoimprintable high refractive index material solutions and the matching gap filling low RI coatings. Looking forward to meet you in Neuchatel!
Inkron introduces a New Structural Adhesive and Underfill product line at Printed Electronics Europe 2019 (April 10-11th, Estrel Convention Center, Berlin). These new adhesives are designed to fully complement Inkron’s existing family of printable electronics products, which also includes stretchable conductors and dielectric inks. Inkron now offers a complete turn-key solution of adhesives, inks and […]