LED lighting solutions are everywhere around us. This trend continues with new innovations made in horticultural lighting, disinfecting lights, adaptive lighting designs and more. To optimize the reliability, efficiency and to enable the ever-increasing trend to smaller and smaller footprint designs are setting tough requirements for LED chip manufacturers. At the same time Micro-Led display development moves quickly forward and is expected to create fully new class of display technology finding applications in augmented reality applications among other. Various 3D sensors (Time of Light and other technologies) are used in automotive (LIDARS) as well as in consumer electronics and security applications for face recognition and controls. All these exemplary applications require high-class optical packaging materials; adhesives, encapsulants and underfills Inkron works with.