Products

Die Attach Adhesives and Encapsulants

Inkron’s range of Die Attach Pastes comprises 3 main product lines identified as IDA-100, 200 and 300 series.

IDA – 100 Series Die Attach Pastes

Designed for applications requiring superior thermal and electrical conductivity.
IDA-100 series are designed for the most demanding electronics and semiconductor applications. IDA-100 series products are silver filled, thermally and electrically conductive pastes. These products are solvent and Pb-free as well as RoHS compliant materials. Inkron’s technology platforms i.e. in-house synthesized siloxane polymers and nano-metal particle production combined with Inkron’s proprietary silver/matrix coupling technology allows Inkron to modify the properties of these products so that varying customer requirements can be met.
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IDA – 200 Series Die Attach Pastes

Designed for applications requiring high thermal conductivity and high reflectivity.
IDA-200 series pastes are designed for demanding electronics and semiconductor applications. IDA-200 series products are filled, thermally conductive and reflective pastes. These products are solvent- and Pb-free as well as RoHS compliant. Inkron’s technology platforms i.e in-house synthesized siloxane polymers and particle production combined with proprietary particle/matrix coupling technology allows us to modify the properties of these products so that varying customer requirements can be met. Special attention has been given to minimizing the contact resistance between the Die attach and the substrate.
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IDA-300 Series Die Attach Pastes

Designed for applications requiring good thermal conductivity and high optical transparency.
IDA-300 series pastes are designed for a range of electronics and semiconductor applications. IDA-300 series products are thermally conductive and optically transparent pastes. These products are solvent- and Pb-free as well as RoHS compliant. Inkron’s technology platforms i.e in-house synthesized siloxane polymers and particle production combined with particle/matrix coupling technology allows us to modify the properties of these products so that the varying customer requirements can be met. Special attention has been given to minimize the contact resistance between the Die Attach and the substrate.
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pot-life
Long Pot Life at RT

thermal-stability-ida
Excellent Thermal Stability with Siloxane Die Attach Materials compared to organic binders.

LED Encapsulants

Materials in the INKRON ILE-500 product family are formulated encapsulation resins designed for demanding LED applications. INKRON’s ILE-500 series include both thermally and UV-curable, organo-siloxane resins with multi-functional crosslinking reactivity, yielding films with high refractive index, transmittance and excellent thermal stability for effective extraction of light out of a wide variety of LED packages. High stability (e.g. maintaining high transparency over extended time at elevated temperatures) makes them excellent candidates for high reliability applications. ILE-500 series products exhibit essentially no out-gassing after cure. Excellent adhesion is achieved to metals, most engineered plastics, and to glass and ceramics. Viscosity can be adjusted to allow easy dispense in a variety of machine configurations.
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