News archive – 2019

Inkron introduces a New Structural Adhesive and Underfill product line at Printed Electronics Europe 2019 (April 10-11th, Estrel Convention Center, Berlin). These new adhesives are designed to fully complement Inkron’s existing family of printable electronics products, which also includes stretchable conductors and dielectric inks. Inkron now offers a complete turn-key solution of adhesives, inks and […]

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Printed electronics comprises of many enabling materials, equipment and components, from mature technologies such as OLED displays to emerging sectors such as structural electronics. If you are involved in the electronics industry you owe it to yourself and your company to explore your opportunities in this growing disruptive sector at the world’s largest event series […]

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LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important conference for the printed electronics industry. The event takes place at Messe München convention center. It is the leading global platform in the industry and provides support in every aspect of the industry, from application to research. It connects, […]

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Find out about the newest arrivals in Inkrons product portfolio and meet us at the SPIE Photonics West tradeshow in the North Hall, Booth #5381 in the Finland Pavillion! Learn how the new ILE-010 barrier coating can boost the reliability and lifetime of your LED products. Or hear more about the wide application range of […]

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