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Meet Inkron at LpS 2017, LED Symposium + EXPO (booth C17) to find out more about our latest material solutions for LED, display and optical device packaging and light optimization. We display our thermally conductive Die attach paste product-series, High and Low Refractive Index Encapsulants and Coatings as well as our printable conductive and dielectric inks and pastes. These products are equally suitable for Wafer Level and Flip chip packaging designs. Further information is also available on Inkron’s packaging services allowing LED and optical device production.