Inkron and Nagase Exhibit their latest LED and optical packaging solutions and materials at 2016 China (Shanghai) International LED Illumination ExhibitionNovember 23, 2016
Shanghai, China and SNIEC (Shanghai New International Expo Center): International LED Illumination Exhibition on December 1-3, 2016
Meet Inkron at this year’s premier LED show in Shanghai and learn about Inkron’s latest material solutions for LED, display and optical device packaging and light optimization. We exhibit our thermally conductive Die attach paste product-series, High and Low Refractive Index Encapsulants and coatings as well as our printable conductive and dielectric inks and pastes. The products for Wafer Level and Flip chip packaging designs are also available. Additionally information is available on Inkron’s opto-packaging services allowing LED and optical device production.