Inkron Exhibits its latest solutions for Wearables and Advanced Electronics Integration at Nepcon Japan 2016January 1, 2016
Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016.
Meet Inkron at Nagase booths E52-40 (Hall 6) and E21-13 (Hall 3) at Nepcon to learn Inkron’s material solutions for Wearable and Advanced Electronics Integration. We explain our low temperature, UV-curable and ink-jetting metal and dielectric inks, optical materials for OLED and flexible displays and encapsulation solutions with highest Refractive Index in the market for Optical Wafer Scale Packaging. See you there !