A 3rd Party study reports Inkron’s IDA-125 nanosilver Die Attach material superior thermal performance in high power density UV COB LEDs. According to the study IDA-125 Die Attach material results in less than 0.2 K/W total thermal impedance between chip die and interconnection substrate. As there is a rapidly growing industrial market for high-power ultraviolet (UV) requiring high-output sources novel packaging solutions are needed in order to ensure maximum efficiency and reliability. Find more about the study and IDA-125 performance here: