News archive – 2014

  Inkron shall exhibit at the IMAPS 2014 , October 14-15th, 2014 in San Diego California. Please come and visit us at our stand to discuss how Inkron’s product line and technology might be of help to you. We will present our latest thermally and electrically conductive paste and ink products as well as their […]

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1.9.2014 Inkron shall exhibit at the  Printed electronics show PE2014 , October 7-9th, 2014 in Grenoble France.  Inkron’s stand is 958. Please come and visit us at our stand to discuss how Inkron’s product line and technology might be of help to you. We will present our latest thermally and electrically conductive paste and ink […]

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  Inkron shall exhibit at the SEMICON Taiwan 2014 , September 3-5th, 2014 in Taipei Taiwan. Please come and visit us at the stand of Grand Trend Corp to discuss how Inkron’s product line and technology might be of help to you. We will present our latest thermally and electrically conductive paste and ink products […]

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Inkron exhibits at the LOPEC 2014 Tradeshow, May 27-28th, 2014 in Munich Germany.  Inkron’s stand is located in Hall B0, stand 519A. Please come and visit us at our stand to discuss how Inkron’s product line and technology might be of help to you. We will present our thermally and electrically conductive paste and ink products […]

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 Inkron’s high electrically and thermally conductive die attach adhesive (25W/mK) IDA-122 is now being introduced world-wide to customers in the LED and Semiconductor industries. This new design in die attach material is based on Inkron’s IP in novel siloxane matrix chemistry and silver coupling technology and will enable innovations at the both a customer’s manufacturing […]

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